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The BSS-3D machine is specifically designed for 2D and 3D deep engraving on molds, matrix, punches and electrodes. This is accomplished through movement of the laser source on a portal with a 3 axis system and a range of 350mm. The centering is done through a high resolution ultra compact camera; working cycles, positioning and programing are managed from the master software.
The BSS-3D laser source gives you the possibility to deep engrave on a working area of 21.65”L X 31.5”W X 15.75”H. Comes equipped with the SLC Sisma software.
Technical Characteristics: BSS-3D